This course presents the electrical characteristics, thermal characteristics, packaging techniques and applications of state-of-the-art power semiconductor devices. In particular, the device structure and fabrication technology for power MOSFETs and IGBTs will be discussed extensively. The integration of these power devices to form Smart Power IC and HV CMOS technologies will also be introduced. An industrial standard Technology CAD tools from Crosslight Inc. will be used extensively to demonstrate the design, analysis, modelling, and optimization of these power devices. Design projects targeting methods to achieve high breakdown voltage, low on-resistance, fast switching speed, and high reliability/ruggedness will be carried out. In addition, the students will be also exposed to selection considerations for "off-the-shelf" devices that would meet the circuit or system level specifications.